The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to develop highly integrated hardware to meet shrinking form and fit factor requirements as well as increasing thermal loads. Emerging packaging materials are continuously evaluated to optimize electrical and thermal performance. The microelectronics lab specializes in state-of-the-art engineering design and assembly including current technologies such as Chip-On-Board (COB) and Multichip Module (MCM) as well as emerging technologies such as STI’s patented packaging technology coined Imbedded Component/Die Technology (IC/DT®).
STI’s involvement in research and development programs, both in component packaging technologies and electronics assembly manufacturing, has brought about the installation of the latest and most advanced equipment and the acquisition of the top people in this field. STI is staffed to design, develop, and assemble a ruggedized electronics assembly to meet your specifications. With experience in Defense, Aerospace, Space, and commercial applications, STI is adept to designing and assembling a product to satisfy your requirements. Contact us today to discuss your application requirements and submit a request for quote (RFQ).
Design and Modeling Capabilities
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• Schematic Design / Import
• PCB Layout Design
• Mixed Technology (TH, SMT, Bare Die, Flip Chip)
• Stacked Die (Wire Bond Optimization)
• 3-D Design Generation
• Coupled Physics Simulation Tool
• Structural Analysis
• Thermal Analysis
• Multi-Field Solver
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ISO Class 6 Cleanroom
An ISO Class 6 (Class 1000) cleanroom houses the microelectronics manufacturing and assembly lab for prototype and low volume production. Assembly materials such as printed circuit boards (PCBs), components, and wire are stored in dry nitrogen cabinets to reduce contamination and degradation. A sophisticated dispenser/placement machine is used for low volume dispense accuracy and repeatability in addition to ±10μm component placement. Component pick options include waffle pack and wafer for high-precision SMT and bare die, including flip chip assembly. Wire bond interconnect is accomplished with a fully automatic ultrasonic wedge bonder utilizing aluminum wire over a wide diameter range for low and high current applications. A two-channel mass flow controller plasma system is employed to prepare surfaces for die attach, wire bonding, and encapsulation. Material qualification and process control are accomplished via a wire pull/die shear tester coupled with high magnification visual inspection.
Prototype / Low-Volume Automated Assembly
STI ensures the integrity of every product designed and manufactured at STI through the implementation of a quality system in accordance with ISO 9001:2008 requirements. Quality control is implemented in the earliest phases of a program beginning with project planning, product design, process development, manufacturing and assembly, and testing/verification documentation.
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| Plasma Etch Inc. |
Datacon Technology GmbH |
Yamato Scientific America Inc. |
Orthodyne Electronics Corp. |
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| Dage Precision Industries Inc. |
LW Scientific |
Test Equipment |
Microelectronics Lab Capabilities
Quality Control
• Incoming Materials Inspection
• Inventory Parts for Traceability
• Dry Nitrogen Storage for all Materials
Surface Modification / Plasma Cleaning
• 13.56MHz Plasma Etch
- Oversized Vacuum Chamber
- Automatic Programming Capability
- Automatic Gas Mixing System
Die Attach
• Automatic Volumetric Dispenser
- High Dispense Performance
• Epoxy Attach
- Automatic Adhesive Dispenser
• Solder Attach
- Slide Fluxer/Dipping Unit
Component Placement
• High Accuracy Placement
- Achievable Placement Accuracy Up to +/- 10 µm
- Autocorrection/Bond Offset Correction
• Single Chip, Multi Chip, Flip Chip Capabilities
• Programmable Bond Force
• Wafer, Waffle Pack, and/or Gel-Pak Handling Capability
• Oversized Substrate Working Range
Curing/Bakeout
• Customized Temperature Profile - Microprocessor Controlled
- Operating Temperature Range: up to 200°C
• Hermetically Sealed Thermocouple Access
- Oversized Vacuum Chamber
• Nitrogen Purge
Interconnects
• 60kHz Ultrasonic Wedge Bonding
• Fully Automatic Small Wire Bonder
- 1.2 to 3 mils Wire Size
• Fully Automatic Large Wire Bonder
- 4 to 20mils Wire Size
Final Inspection
• Manual Inspection (100x Magnification Microscope)
- Cleanliness
- Wire Bond Accuracy
- Workmanship
• Automated Inspection (AOI)
- Die Attach Accuracy
- Component Placement Accuracy
• Real Time X-RAY
- Flip Chip Bump Analysis
- See the Analytical Lab’s Capabilities
Package Seal
• Underfill dispense
• Glob Top
• Dam and Fill/Encapsulation
Electrical Testing
• 500MHz, 4-Channel Oscilloscope
- Digital Storage Capability
• Multi-point Continuity/Component Testing
- Test for Opens, Shorts, Miswires, High Resistance Connections, and/or Insulation
Resistance Problems
• Low-Voltage/Continuity Testing
• High Voltage Testing (Hipot)
- Component Testing:
• Resistors, Diodes, Capacitors, Switches, Twisted Pairs, and Other Custom
Components
• Data Logging
- Monitoring and Data Acquisition
• Voltage, Resistance, Current, Thermocouple, etc.
• Function/Arbitrary Waveform Generator
- Pulse Generation
- Custom Waveform Generation
• Internal AM, FM, PM, FSK, and PWM Modulation
• General Lab Equipment
- Precision Current Loads
• Strain Gage Testing
- Printed Circuit Board (Ambient, High Temperature)
- Contact us for a quote
Materials Qualification
• Bond Testing
- Wire Pull
- Bump Shear
- Ball Shear
- Die Shear
• Surface Insulation Resistance (SIR) Testing
- Customized Materials Evaluation Test Method
• Contact us for a quote
- Voltage Bias during Environmental Testing
- Continuous Monitoring during Environmental Testing
- Insulation Resistance Failure Detection/Hipot Testing
For more information contact Casey Cooper at 256-705-5511 or ccooper@stielectronicsinc.com .