IPC-A-610 Certified IPC Specialist (CIS) Certification Program

The IPC-A-610 document, “The Acceptability of Electronic Assemblies” is the most widely used specification for the electronics manufacturing industry. The IPC-A-610 Certified IPC Specialist (CIS) Course is modularized to allow companies maximum flexibility in training their CIS’s. The CIS course consists of nine modules. Modules one and two are prerequisites to any of the other seven.

Module 1: This module covers the introduction and IPC Professional Policies and Procedures. The policies and procedure for the CIS program are discussed in depth to provide students with the information needed to be a CIS. This module along with module two have an open and closed book exam which require a 70% or greater average between the tests, no one score being below 60%.

Module 2: This module describes the Forward, Applicable Documents and Handling in accordance with IPC-A-610. The module discusses the Scope, Purpose, Specialized Designs, Terms and Definitions, Inspection Methodology, Magnification Aids and Lighting along with the Applicable Documents and EOS/ESD requirements of IPC-A-610.

Module 3: This module provides the information necessary for Hardware Installation. It includes Connector Handles, Extractors, Latches, Connector Pins, Wire bundle Securing, and Routing. An open book exam is given with a minimum score of 70% required.

Module 4: This module provides the requirements for Soldering (including High Voltage). The general soldering requirements are discussed in this module. Also discussed are the various Soldering Anomalies (exposed basis metal, nonwetting, fillet lift etc.), High Voltage Terminals, Solder Cup Insulation, Through Hole Connections, Flared flange Terminals. An open book exam is given with a minimum score of 70% required.

Module 5: This module provides requirements for Terminal Connections. The topics covered are Edge Clips, Swaged Hardware, Wire/Lead Preparation, Lead Forming, Service Loops Terminals, Lead Wire Placement, Insulation, Conductor Terminals Soldering and Conductor Damage. An open book exam is given with a minimum score of 70% required. NOTE: Modules four and eight are prerequisites to this module.

Module 6: This module provides the requirements for Through Hole Technology. The items discussed are Component Mounting, Heat Sinks, Component Securing, Unsupported Holes and Supported Holes. An open book exam is given with a minimum score of 70% required. NOTE: Modules four and eight are prerequisites to this module.

Module 7: This module provides the requirements for Surface Mount Assemblies. The areas covered are SMT Connections, Chip Components Bottom Only Terminations, Rectangular or Square End Components, Cylindrical End Cap Terminations, Castellated Terminations, Flat Ribbon, L, and Gull Wing Leads, Round or Flattened Leads, J Leads, Butt/I Connections, Flat Lug Leads, Tall Profile Components, Inward Formed L-Shaped Ribbon Leads, Surface Mount Area Array, Plastic Quad Flat Pack-No Leads, components with Bottom Thermal Planes. An open book exam is given with a minimum score of 70% required. NOTE: Modules four and eight are prerequisites to this module.

Module 8: This module provides the requirements for Component Damage and Printed Circuit Boards and Assemblies. The topics discussed are loss of Metallization and Leaching, Chip Resistor Element, Chip Components, Connectors, Laminate Conditions, Marking, Cleanliness, and Coatings. An open book exam is given with a minimum score of 70% required.

Module 9: This module provides the requirements for Solderless Wire Wrap. The areas covered are Solderless Wrap, Jumper Wires Component Mounting, and Connector Wire Dress Strain/Stress Relief. An open book exam is given with a minimum score of 70% required.

Upon successful completion, the students will receive an IPC-A-610 CIS certificate. Each certificate will indicate the appropriate modules the students were trained in. This certification is valid for 2 years. Students will need to complete a recertification course prior to their certificate expiration.